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SK hynix

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SK hynix Inc.
SK하이닉스 주식회사
The SK hynix wordmarki
Formerly Hyundai Electronics (1983–2001)
Hynix Semiconductor (2001–2012)[1]
Type Public company[2]
Traded as KRX: 000660
Nasdaq: SKHY (American depositary shares)[2]
Founded February 1983, as Hyundai Electronics[1]
Headquarters Icheon, Gyeonggi Province, South Korea[3]
Industry Semiconductors[3]
Products DRAM
NAND flash memory
High Bandwidth Memory
Solid-state drives[3]
Key people Kwak Noh-Jung (President and CEO)[4]
Ko Seung-Beom (Chair of the board)[5]
Revenue ₩97.15 trillion (FY2025)[6]
Operating profit ₩47.21 trillion (FY2025)[6]
Employees 46,863 (2024)[7]
Parent SK Square (20.5%), part of SK Group[8]
Subsidiaries Solidigm
SK keyfoundry
SK hynix system ic[1]
Headquarters
Aerial view of the SK hynix Icheon campus, showing the fab buildings with the company wordmark painted on their roofsi
The Icheon campus in Gyeonggi Province — the company's original 1983 site and its headquarters
Official links
Homepage
Newsroom
Products & Solutions
YouTube
Instagram
LinkedIn[9]
SK
Group
[ Expand · Collapse ]

SK hynix Inc.[note 1] (SK하이닉스) is a South Korean semiconductor company and the memory-chip arm of SK Group. Headquartered in Icheon, Gyeonggi Province, it designs and manufactures DRAM, NAND flash memory and the stacked High Bandwidth Memory used by artificial-intelligence accelerators, and is one of three companies — with Samsung Electronics and Micron Technology — that between them supply almost all of the world's memory.[3][2]

The name hynix came from Hyundai Electronics (Hynics → hynix), back when Hyundai owned the company. The SK prefix was added in March 2012, a month after SK Telecom took control.[1] More than two decades after leaving Hyundai, the company still trades under the half of its name that came from there rather than under an SK-only brand.

The name is styled SK hynix, with a lowercase h — that is the form the company uses on its own site and in its filings with the U.S. Securities and Exchange Commission.[3][2] News wires and business press very often write "SK Hynix" instead; it is a house-style choice on their part, not the company's own rendering.

The company was founded in February 1983 as Hyundai Electronics, absorbed its domestic rival LG Semicon in a government-brokered merger in 1999, renamed itself Hynix Semiconductor in 2001, and spent most of the following decade under creditor control after the debt taken on in that period nearly destroyed it.[1][10] SK Telecom bought a controlling stake in February 2012, and the company took its present name a month later.[1][11]

An early bet on High Bandwidth Memory — SK hynix built the first TSV-stacked HBM in 2013 and has shipped every subsequent generation first — turned into the defining advantage of the AI era.[1][12] In 2025 the company posted revenue of ₩97.15 trillion and an operating profit of ₩47.21 trillion, the largest of any listed Korean company and ahead of Samsung Electronics for the first time.[6][13] On July 10, 2026 it listed American depositary shares on the Nasdaq, raising US$26.5 billion.[2]

1 History✎

1.1 Hyundai Electronics (1983–1999)✎

Hyundai Electronics was established in February 1983 as the semiconductor venture of the Hyundai Group; the company's own later filings render the founding name as Hyundai Electronics Industries.[1][14] Construction of the Icheon plant began in October of the founding year; a pilot line produced 16K SRAM by December 1984, and 64K DRAM entered mass production in May 1985.[1]

1.2 The LG Semicon merger and Hynix Semiconductor (1999–2001)✎

After the 1997 Asian financial crisis, the Korean government pressed the chaebol into a set of industry consolidations known as the "Big Deal", under which Hyundai and LG were to combine their chip businesses.[15] The definitive agreement was signed on May 20, 1999: Hyundai acquired 59% of LG Semicon — 91,223,594 shares — for ₩2.56 trillion, on a payment schedule running to June 2002.[14] Control passed in July 1999 and the legal merger completed that October.[1]

The purchase gave the combined company the Cheongju fabs it still operates, but it was paid for with debt at the worst possible moment in the memory cycle. The company changed its name to Hynix Semiconductor in March 2001 and completed its separation from the Hyundai Group that August, shedding its handset, network-equipment and TFT-LCD businesses along the way.[1]

1.3 Creditor control (2001–2012)✎

Merger talks with Micron Technology opened in December 2001 and reached a tentative agreement in April 2002, but the Hynix board rejected the terms the following month as too low.[10] With that route closed, a creditor group led by Korea Exchange Bank approved a rescue on December 30, 2002 — a ₩1.9 trillion debt-for-equity swap, a 21-to-1 writedown of existing shares, and an extension on ₩3 trillion of debt — leaving the creditors with roughly 86% of a company carrying ₩8.6 trillion of debt.[16][10]

The restructuring drew countervailing-duty actions in the United States, the European Union and Japan, all alleging that the bailout amounted to a hidden subsidy; a WTO panel ruled against Japan's measures in 2007 and the American order was lifted in 2008.[1][10] Hynix sold its non-memory business in October 2004 — the operation that became MagnaChip — and left creditor administration ahead of schedule in July 2005, though the creditor banks remained its largest shareholders for another seven years.[1]

1.4 Acquisition by SK (2011–2012)✎

SK Telecom agreed in November 2011 to buy a controlling stake, and closed on February 14, 2012, paying ₩3.37 trillion for 21.05% at ₩23,099 per share — the largest acquisition in its history.[11] Chey Tae-won, chairman of SK Group, took the chair of the semiconductor company, and in March 2012 it was renamed SK hynix.[1]

The holding arrangement changed once more in November 2021, when SK Telecom spun off its non-telecom investments into a new company, SK Square, which inherited the SK hynix stake.[17]

1.5 The AI memory era (2013–present)✎

SK hynix developed the first TSV-based High Bandwidth Memory in 2013 and brought it to market with AMD the following year, at a point when the industry regarded stacked memory as a niche for graphics cards.[1][18] It was the first to mass-produce HBM2E in 2020, the first to develop HBM3 in 2021 and the first to supply it to NVIDIA in 2022, and the first to ship 8-layer and 12-layer HBM3E in 2024.[19][20][21]

In parallel the company bought its way to scale in NAND. It acquired Intel's NAND and solid-state drive business for a headline US$9 billion announced in October 2020, taking the SSD operation and the Dalian fab in a first closing in December 2021 — the business was rebranded Solidigm — and Intel's NAND intellectual property and research staff in a final closing in March 2025.[22][23][24] It is also an investor in Kioxia, having committed ¥395 billion in 2017 to the Bain Capital consortium that bought Toshiba's memory unit.[25]

The generative-AI build-out that began in 2023 turned that HBM position into the company's central business. SK hynix completed development of HBM4 — the first generation to double the interface to 2,048 I/O — in September 2025, unveiled a 16-layer 48GB part at CES 2026, and shipped HBM4E samples in June 2026.[12][26][27] On October 29, 2025 the company said it had already sold its entire DRAM and NAND output for the whole of the following year.[28]

2 Products✎

2.1 DRAM✎

DRAM is the larger half of the business. SK hynix moved to EUV lithography with its 1a nm node in July 2021, reached 1b nm in 2023 and 1c nm — the sixth generation of its 10nm-class process — in August 2024, and in 2025 became the first company to put a High-NA EUV scanner into commercial use, at the M16 fab in Icheon.[29][30][31]

The product line runs from server DDR5 — including 256GB 3DS RDIMM and MRDIMM modules — through GDDR7 graphics memory at 32 Gbps to the LPDDR family used in phones and, increasingly, in AI servers.[32][33] A newer category sits between the two: SOCAMM2, a 192GB low-power server module built on 1c LPDDR5X for NVIDIA's Vera Rubin platform, entered mass production in April 2026.[34]

2.2 High Bandwidth Memory✎

HBM stacks DRAM dies vertically and connects them with through-silicon vias, trading manufacturing difficulty for bandwidth. Every generation since HBM2E has reached volume production at SK hynix before its competitors, a lead the company attributes in part to its MR-MUF packaging method, which fills the gaps between stacked dies with a protective material in a single reflow step rather than one layer at a time.[18][21]

The company's own record of the line runs as follows.[1][12][27]

HBM generations
Generation Milestone Date
HBM First TSV-based HBM developed 2013
HBM2E Mass production July 2020
HBM3 Development; first supply to NVIDIA October 2021; June 2022
HBM3E (8-layer) Volume production March 2024
HBM3E (12-layer) Volume production September 2024
HBM4 Development completed, 2,048 I/O September 2025
HBM4E Samples shipped June 2026

In April 2024 SK hynix agreed with TSMC to build the HBM4 base die on TSMC's logic process, a three-cornered arrangement between memory maker, foundry and customer that departs from the industry's usual practice of each memory vendor making its own base die.[35]

2.3 NAND flash and storage✎

The NAND business combines SK hynix's own 4D NAND line with Solidigm's enterprise SSD portfolio. The company mass-produced the first NAND above 300 layers — a 321-layer 1Tb TLC die — in November 2024, and a 2Tb QLC version in August 2025.[36][37]

At the 2025 Open Compute Project summit the company set out an "AI NAND" roadmap splitting future storage into three lines — AIN P for performance, AIN D for density and AIN B for bandwidth, the last built on a High Bandwidth Flash architecture being standardized jointly with SanDisk.[38]

3 Facilities✎

Production is concentrated in two Korean campuses, with assembly and a second DRAM base in China and a first American plant under construction.

  • Icheon, Gyeonggi Province — the original 1983 site and the corporate headquarters. It holds the M10, M14 and M16 fabs; M16, completed in January 2021 at a cost of ₩3.5 trillion, was the company's first EUV fab and now houses its High-NA scanner.[39][31]
  • Cheongju, North Chungcheong Province — the campus inherited from LG Semicon, now the centre of NAND production and of HBM packaging. The M15X fab, approved in April 2024 as a ₩5.3 trillion project within a longer-term programme above ₩20 trillion, began wafer input in the first quarter of 2026.[40][2]
  • Yongin, Gyeonggi Province — a four-fab cluster on a 4.15 million m² site, approved by the board in July 2024 with ₩9.4 trillion for the first fab and expanded by a further ₩21.6 trillion in February 2026, bringing that fab alone to roughly ₩31 trillion. Its first clean room is due in February 2027.[41][42]
  • West Lafayette, Indiana, United States — a US$3.87 billion advanced HBM packaging plant and research testbed at Purdue Research Park, agreed in April 2024 and broken ground in April 2026 for production in the second half of 2028. It received up to US$458 million in direct funding under the CHIPS and Science Act.[43][44]
  • China — DRAM at Wuxi, assembly and test at Chongqing, and the NAND fab at Dalian acquired with Intel's storage business.[1][2]

The Chinese fabs became a regulatory question in 2025. The US Bureau of Industry and Security revoked SK hynix's Validated End-User authorization for its China sites with effect from December 31, 2025, replacing a standing licence with an annual approval process for American-origin equipment.[45][2]

4 Corporate structure✎

SK hynix sits at the bottom of a three-step chain: SK Inc., the holding company of SK Group, controls SK Square, which held 20.5% of SK hynix together with its affiliates as of May 2026. The National Pension Service held 8.1% and BlackRock Fund Advisors 5.1%.[8] The 20% figure is not incidental — Korea's Monopoly Regulation and Fair Trade Act requires SK Square to keep at least a fifth of the shares, and the 2026 Nasdaq offering was sized so that its stake would land just above that floor after the new shares were issued.[2]

Kwak Noh-Jung has served as president and chief executive since 2022. The board has been chaired since March 2026 by Ko Seung-Beom, an independent director; of its ten seats, six are independent.[5]

Principal subsidiaries are Solidigm, the American SSD business built from Intel's storage division; SK keyfoundry, a Cheongju specialty analog foundry bought from MagnaChip in 2022 and renamed at the start of 2024; and SK hynix system ic, a foundry subsidiary established in 2017 with an 8-inch operation in Wuxi.[1][46] In January 2026 the company announced that the Solidigm legal entity would be reorganized into a US artificial-intelligence solutions arm, with a US$10 billion capital commitment, while the SSD business continued under the Solidigm brand in a newly created company.[47]

5 Finances✎

Results are reported under K-IFRS on a consolidated basis.[6][48]

Consolidated results (K-IFRS, ₩ trillion)
Period Revenue Operating profit Net income
FY2024 66.19 23.47 19.80
FY2025 97.15 47.21 42.95
1Q 2026 52.58 37.61 40.35

FY2025 was a record on every line, and its ₩47.21 trillion operating profit exceeded Samsung Electronics' ₩43.53 trillion — the first time SK hynix had earned more than its larger domestic rival, and the highest operating profit of any listed Korean company.[6][13] The first quarter of 2026 was stronger still, with a 72% operating margin.[48] Capital expenditure has risen with the AI cycle, from ₩8.3 trillion in 2023 to ₩27.5 trillion in 2025.[2]

Shareholder returns for FY2025 came to ₩14.3 trillion: ₩2.1 trillion in dividends and the cancellation of 15.3 million treasury shares worth ₩12.2 trillion.[6]

6 Market position✎

Gartner's preliminary 2025 rankings put SK hynix third among all semiconductor companies by revenue, at US$60.6 billion, ahead of Intel and behind NVIDIA and Samsung Electronics.[49]

In DRAM the lead has changed hands twice in recent years. SK hynix passed Samsung Electronics in the first quarter of 2025 to take the top position in DRAM revenue for the first time since its founding, and held it for three quarters; Samsung regained the lead in the fourth quarter of 2025 and extended it through the first quarter of 2026, when TrendForce put the split at Samsung 38.5%, SK hynix 28.8% and Micron 22.4%.[50][51] The swing reflects product mix rather than execution: conventional DRAM contract prices roughly doubled quarter on quarter in early 2026 while HBM prices softened, which favoured the vendor with the smaller HBM share.[51]

In HBM itself SK hynix has led since the category became commercially significant, with reported shares between roughly a half and two-thirds depending on the quarter and on whether bit output or revenue is measured; Counterpoint put it at 57% of HBM revenue in the third quarter of 2025.[52] Its exposure to a single customer has grown with it: NVIDIA accounted for about 27% of SK hynix revenue in the first half of 2025, against 16% for 2024.[53] In July 2026 SK Group and NVIDIA announced an expanded partnership covering AI infrastructure in Korea, including a two-gigawatt AI facility to be operated by SK Telecom from 2027 using SK hynix memory.[54]

In NAND flash the SK group — SK hynix and Solidigm counted together — is consistently the second-largest supplier behind Samsung Electronics.[55]

7 Nasdaq listing✎

SK hynix listed American depositary shares on the Nasdaq Global Select Market on July 10, 2026 under the ticker SKHY. The offering covered 17,790,000 common shares represented by 177.9 million ADSs — each ADS representing one-tenth of a common share — priced at US$149.00 for gross proceeds of US$26.51 billion, the largest US share sale ever by a foreign company.[2][56][57] The shares rose sharply on debut after a book reported as more than seven times oversubscribed, and the newly issued underlying shares were due to list on the KOSPI on July 29, 2026.[57][56]

The listing came at the top of a run that had made SK hynix, in June 2026, the most valuable listed company in South Korea, passing Samsung Electronics for the first time.[58] That run did not hold: on July 13, three days after the debut, the shares fell about 15% in a market-wide selloff that triggered a trading halt on the Kospi.[59]

Speaking on the day of the listing, Kwak Noh-Jung said the industry faced its tightest supply conditions on record in the coming year, with demand outrunning supply "even beyond 2030".[60]

8 See also✎

SK
Group
[ Expand · Collapse ]
  1. "History." SK hynix (official). [https://www.skhynix.com/company/UI-FR-CP05/ skhynix.com/company]. Retrieved July 2026.
  2. SK hynix Inc., Form 424B4 (final prospectus), filed with the U.S. Securities and Exchange Commission, July 9, 2026. [https://www.sec.gov/Archives/edgar/data/2120882/000119312526299963/d32785d424b4.htm sec.gov]. Retrieved July 2026.
  3. "About Us." SK hynix (official). [https://www.skhynix.com/company/UI-FR-CP02/ skhynix.com/company]. Retrieved July 2026.
  4. SK hynix Inc., Form F-6 registration statement, filed with the U.S. Securities and Exchange Commission, July 1, 2026. [https://www.sec.gov/Archives/edgar/data/2120882/000119380526000898/e665622_f6-skhynix.htm sec.gov]. Retrieved July 2026.
  5. "Corporate Governance — Board of Directors." SK hynix (official). [https://www.skhynix.com/sustainability/UI-FR-SA1502/ skhynix.com/sustainability]. Retrieved July 2026.
  6. "SK hynix Announces FY25 Financial Results." SK hynix Newsroom (official), January 28, 2026. [https://news.skhynix.com/en/sk-hynix-announces-fy25-financial-results/ news.skhynix.com]. Retrieved July 2026.
  7. "SK hynix Fact Sheet." SK hynix Newsroom (official). [https://news.skhynix.com/corporate/fact-sheet/ news.skhynix.com]. Retrieved July 2026.
  8. "Shareholder Status." SK hynix Investor Relations (official). [https://www.skhynix.com/ir/UI-FR-IR04/ skhynix.com/ir]. Retrieved July 2026.
  9. "SK hynix." SK hynix (official) — site footer channel links. [https://www.skhynix.com/ skhynix.com]. Retrieved July 2026.
  10. Cooper, William H. Hynix Semiconductor: Trade Dispute with the United States, CRS Report RL31238. Congressional Research Service. [https://www.everycrsreport.com/reports/RL31238.html everycrsreport.com]. Retrieved July 2026.
  11. "SK Telecom completes Hynix takeover." The Korea Times, February 14, 2012. [https://www.koreatimes.co.kr/business/companies/20120214/sk-telecom-completes-hynix-takeover koreatimes.co.kr]. Retrieved July 2026.
  12. "SK hynix Completes World's First HBM4 Development and Readies Mass Production." SK hynix Newsroom (official), September 11, 2025. [https://news.skhynix.com/en/sk-hynix-completes-worlds-first-hbm4-development-and-readies-mass-production/ news.skhynix.com]. Retrieved July 2026.
  13. "SK Hynix beats Samsung on 2025 profit as AI memory demand surges." CNBC, January 29, 2026. [https://www.cnbc.com/2026/01/29/sk-hynix-beats-samsung-2025-profit-ai-memory-hbm.html cnbc.com]. Retrieved July 2026.
  14. "Hyundai and LG Sign Definitive Agreement on Acquisition of LG Semicon by Hyundai Electronics Industries." SK hynix Newsroom (official), May 20, 1999. [https://news.skhynix.com/en/hyundai-and-lg-sign-definitive-agreement-on-acquisition-of-lg-semicon-by-hyundai-electronics-industries/ news.skhynix.com]. Retrieved July 2026.
  15. "Hyundai and LG Semicon to merge chip ops." EE Times, September 1998. [https://www.eetimes.com/hyundai-and-lg-semicon-to-merge-chip-ops/ eetimes.com]. Retrieved July 2026.
  16. "Creditors approve bailout for chip giant Hynix." The Irish Times, December 31, 2002. [https://www.irishtimes.com/news/creditors-approve-bailout-for-chip-giant-hynix-1.454223 irishtimes.com]. Retrieved July 2026.
  17. "SK Telecom Completes Company Split." SK Telecom Newsroom (official), November 2021. [https://news.sktelecom.com/en/1090 news.sktelecom.com]. Retrieved July 2026.
  18. "The Story of SK hynix's HBM Development." SK hynix Newsroom (official). [https://news.skhynix.com/the-story-of-sk-hynixs-hbm-development/ news.skhynix.com]. Retrieved July 2026.
  19. "SK hynix Starts Mass Production of High-Speed DRAM, HBM2E." SK hynix (official, via PR Newswire), July 2, 2020. [https://www.prnewswire.com/news-releases/sk-hynix-starts-mass-production-of-high-speed-dram-hbm2e-301087356.html prnewswire.com]. Retrieved July 2026.
  20. "SK hynix to Supply Industry's First HBM3 DRAM to NVIDIA." SK hynix (official, via PR Newswire), June 8, 2022. [https://www.prnewswire.com/news-releases/sk-hynix-to-supply-industrys-first-hbm3-dram-to-nvidia-301563831.html prnewswire.com]. Retrieved July 2026.
  21. "SK hynix Begins Volume Production of the World's First 12-Layer HBM3E." SK hynix Newsroom (official), September 25, 2024. [https://news.skhynix.com/en/sk-hynix-begins-volume-production-of-the-world-first-12-layer-hbm3e/ news.skhynix.com]. Retrieved July 2026.
  22. "SK hynix to Acquire Intel NAND Memory Business." SK hynix (official, via PR Newswire), October 19, 2020. [https://www.prnewswire.com/news-releases/sk-hynix-to-acquire-intel-nand-memory-business-301155337.html prnewswire.com]. Retrieved July 2026.
  23. "SK hynix Completes the First Phase of Intel NAND and SSD Business Acquisition." SK hynix Newsroom (official), December 30, 2021. [https://news.skhynix.com/en/sk-hynix-completes-the-first-phase-of-intel-nand-and-ssd-business-acquisition/ news.skhynix.com]. Retrieved July 2026.
  24. Intel Corporation, Form 8-K, filed with the U.S. Securities and Exchange Commission, March 27, 2025. [https://www.intc.com/filings-reports/all-sec-filings/content/0000050863-25-000060/intc-20250327.htm intc.com]. Retrieved July 2026.
  25. "SK hynix Inc.'s Board Approved a Plan to Invest in Toshiba Memory Corporation." SK hynix Newsroom (official), September 28, 2017. [https://news.skhynix.com/sk-hynix-inc-s-board-approved-a-plan-to-invest-in-toshiba-memory-corporation-2/ news.skhynix.com]. Retrieved July 2026.
  26. "SK hynix Showcases Next-Generation AI Memory Innovations at CES 2026." SK hynix Newsroom (official), January 5, 2026. [https://news.skhynix.com/en/sk-hynix-showcases-next-generation-ai-memory-innovations-at-ces-2026/ news.skhynix.com]. Retrieved July 2026.
  27. "SK hynix Ships Samples of 12-Layer Next-Gen HBM4E." SK hynix (official, via PR Newswire), June 17, 2026. [https://www.prnewswire.com/news-releases/sk-hynix-ships-samples-of-12-layer-next-gen-hbm4e-302803714.html prnewswire.com]. Retrieved July 2026.
  28. "SK hynix Announces 3Q25 Financial Results." SK hynix Newsroom (official), October 29, 2025. [https://news.skhynix.com/sk-hynix-announces-3q25-financial-results/ news.skhynix.com]. Retrieved July 2026.
  29. "SK hynix Starts Mass Production of 1anm DRAM Using EUV Equipment." SK hynix Newsroom (official), July 12, 2021. [https://news.skhynix.com/en/sk-hynix-starts-mass-production-of-1anm-dram-using-euv-equipment/ news.skhynix.com]. Retrieved July 2026.
  30. "SK hynix Develops Industry-First 1c DDR5." SK hynix Newsroom (official), August 29, 2024. [https://news.skhynix.com/en/sk-hynix-develops-industry-first-1c-ddr5/ news.skhynix.com]. Retrieved July 2026.
  31. "SK hynix Introduces Industry's First Commercial High-NA EUV." SK hynix Newsroom (official), September 3, 2025. [https://news.skhynix.com/en/sk-hynix-introduces-industrys-first-commercial-high-na-euv/ news.skhynix.com]. Retrieved July 2026.
  32. "SK hynix Enhances Leadership in Graphics Memory With Introduction of Industry-Best GDDR7." SK hynix Newsroom (official), July 30, 2024. [https://news.skhynix.com/en/sk-hynix-enhances-leadership-in-graphics-memory-with-introduction-of-industry-best-gddr7/ news.skhynix.com]. Retrieved July 2026.
  33. "SK hynix Develops 1c LPDDR6." SK hynix Newsroom (official), March 10, 2026. [https://news.skhynix.com/en/1c-lpddr6-development-2026/ news.skhynix.com]. Retrieved July 2026.
  34. "SK hynix Begins Mass Production of 192GB SOCAMM2." SK hynix Newsroom (official), April 19, 2026. [https://news.skhynix.com/en/mass-production-socamm2-192gb/ news.skhynix.com]. Retrieved July 2026.
  35. "SK hynix Partners With TSMC to Strengthen HBM Technological Leadership." SK hynix Newsroom (official), April 19, 2024. [https://news.skhynix.com/en/sk-hynix-partners-with-tsmc-to-strengthen-hbm-technological-leadership/ news.skhynix.com]. Retrieved July 2026.
  36. "SK hynix Starts Mass Production of World-First 321-High NAND." SK hynix Newsroom (official), November 20, 2024. [https://news.skhynix.com/en/sk-hynix-starts-mass-production-of-world-first-321-high-nand/ news.skhynix.com]. Retrieved July 2026.
  37. "SK hynix Begins Mass Production of 321-Layer QLC NAND Flash." SK hynix Newsroom (official), August 24, 2025. [https://news.skhynix.com/en/sk-hynix-begins-mass-production-of-321-layer-qlc-nand-flash/ news.skhynix.com]. Retrieved July 2026.
  38. "SK hynix Presents Next-Generation NAND Storage Product Strategy at OCP 2025." SK hynix Newsroom (official), October 26, 2025. [https://news.skhynix.com/en/sk-hynix-presents-next-generation-nand-storage-product-strategy-at-ocp-2025/ news.skhynix.com]. Retrieved July 2026.
  39. "SK hynix Announces the Completion of M16 Plant Construction." SK hynix (official, via PR Newswire), February 1, 2021. [https://www.prnewswire.com/news-releases/sk-hynix-announces-the-completion-of-m16-plant-construction-301218597.html prnewswire.com]. Retrieved July 2026.
  40. "SK hynix to Produce DRAM From M15X in Cheongju." SK hynix Newsroom (official), April 24, 2024. [https://news.skhynix.com/en/sk-hynix-to-produce-dram-from-m15x-in-cheongju/ news.skhynix.com]. Retrieved July 2026.
  41. "SK hynix Board Approves Yongin Semiconductor Cluster Plan." SK hynix Newsroom (official), July 26, 2024. [https://news.skhynix.com/en/sk-hynix-board-approves-yongin-semiconductor-cluster-plan/ news.skhynix.com]. Retrieved July 2026.
  42. "New Facility Investment for Yongin Semiconductor Cluster." SK hynix Newsroom (official), February 25, 2026. [https://news.skhynix.com/new-facility-investment-for-yongin-semiconductor-cluster/ news.skhynix.com]. Retrieved July 2026.
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